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Wire Bonding is the technique of establishing the electrical connections between a silicon chip and the external leads of a semiconductor device using very fine bonding wire during semiconductor device fabrication. These wires are made of materials such as Copper (Cu), Gold (Au), and Aluminum (Al). Wire Bonder machines such as ASM AB339 Eagle

Wire Bonder manual Our HB05 gives you an easy access to the topic of bonding. Look, aim, bond - done. 17μm to 75μm Wire gold, aluminum, silver & copper wire One Bond Head wedge, ball, bump & ribbon bonding Light Weight weighs in total only 29kg Compact Design smooth and easy use 4" TFT fast and easy control of all bonding parameters

Industry Leader in semiconductor wire bonder, die bonder, wedge bonder, pull test and bonder tools. Leader in manufacturing renowned line of wire bonding and die attach machines, wire pull and shear test equipment, ultrasonic components, and accessories for the microelectronics packaging industry.

The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar's proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders. LEARN MORE!

Heraeus' wedge bonding aluminium wire consists of AlSi 1 %-Legierung (99 % aluminum, 1 % silicon) and is trademarked as AIW-29S. Wedge Bond Video. Read More. Ribbons. for microwave devices and high-frequency applications. Heraeus' ribbons are typically custom-manufactured to exacting specifications. For best results, precursor metals with a

The West Bond Wire Bonder is a semi-automatic wire bonder that can accommodate both wedge and ball bonding to interconnect aluminum or gold wire leads to devices. Three ultrasonic bonding methods can be executed; wedge bonding with angled wire feed for best loop control, wedge bonding with vertical feed for access to deep workpieces, selected

Series 53: Manual Wire Bonders. • Complete, manual table top wire bonder. • If you need 1 to 1,000 bonds/day. • Wire bonder for small production volumes, high quality requirements. • Dual wire clamp system for reproducible loop and tails. • Gold-ball, thin wire wedge-wedge, thin wire deep access, heavy wire, heavy ribbon.

Fully Automatic Wire Bonders · Series 58 - Fully Automatic · If you need 1,000 to 100,000 wirebonds per day · A complete high productivity tabletop wire bonder at 

Innovative Industry-Leading Ball Bonding Solutions. Kulicke & Soffa's ball bonders are the leading generation of semiconductor assembly equipment for today's most challenging applications. With our long-standing tradition of innovation and technology leadership, the K&S ball bonders set new standards for performance, productivity, reliability

This Orthodyne Electronics Ultrasonic Heavy Wire Bonder Model 20 was removed from a university lab where it was surplus to requirements. The lab assured us the system was in good working order when last used. The $6,852 Caerphilly, United Kingdom Click to Contact Seller Trusted Seller Orthodyne M360C Heavy Wire Bonders For Sale USED

The Westbond 7476E wire bonder is a two-way convertible wedge to wedge ultrasonic bonder designed to interconnect wire leads to semi-conductor, 

Hughes 2470-V Palomar Automatic Wedge Wire Bonder Aluminum & Gold - Bad CMOS Bat Aluminum and Gold wire bonding Cycle Time: 750ms per wire with an approximate wire length of 0.025 inches Table Range: 5 x 12 inches Digital servos Looping: multiple 17438 SKU: 17438 Weight: 760.00 LBS. Was:

Wedge Bonder. K&S is the leader in wire and ribbon bonding for power semiconductors, automotive power modules, and industrial power hybrids. K&S wedge bonders ultrasonically bond round aluminum wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminum ribbons from 500 x 100 to 2000 x

Wire bonding can connect bond pads on devices to the leads of a package such as DIP or TO-5 cases. It can also be used to interconnect bond pads between two devices, the same device or to a printed circuit board. Contents 1 Equipment 1.1 MPP iBond 5000 Wedge Bonder 1.2 MPP iBond 5000 Ball Bonder 2 Method of operation 3 Design considerations

Manual Wire Bonder by MPP, formerly Kulicke and Soffa (K&S). Manual wire bonding equipment including ultrasonic wedge bond or ball bonding machines.

HB05. Manual Wire Bonder. ​. Ideal for laboratories and pilot production lines. Wedge, Ball, Bump and Ribbon bonding. 17µ to 75µ Wire & 25µ x 250µ Ribbon.

automatic wire bonder HB10 Contact With automatic Z- Axis Our Bonder can be configurated individually and meet almost any task and can fit into almost any budget. Touch Screen Easy Handling and Control with the 6,5" TFT Our long tested 6,5"control automatic wire bonder HB16 Contact

It is the only wire bonder on the market offering the possibility to bond fine and heavy wire or heavy ribbon in a single machine. Benefits. Combination of fine 

The wirebonder is designed for ultrasonic, thermosonic, or thermocompression wedge bonding of IC's, hybrids, microwave devices, and laser diodes using gold 

Description: Wire bonding is the method of interconnecting between device to device, device to package, or device to printed circuit board. Wire bonding is